rigid pcb capability

 

No
Item


Technical data

1Number of Layers

1-40Layers

2Max.Board Size

508*610mm

3Board thickness

0.2-5.0mm

4Min Line Width/Space

4mil/4mil(0.1/0.1mm)

5Min.S/M Pitch

0.1mm(4mil)

6Finish Drill Hole (Mechanical)

0.2mm--6.30mm

7PTH Wall Thickness>0.020mm(0.8mil)

8Hole Dia.Tolerance(PTH)

±0.075mm(3mil)

9Hole Dia.Tolerance(NPTH)

±0.05mm (2mil)

10Hole Position Deviation

±0.05mm (2mil)

11Outline Tolerance

±0.10mm (4mil)

12Twist&Bow

≤0.7%

13Insulation Resistance

>1012Ω Normal

14Through hole resistance

<300Ω Normal

15Electric strength

>1.3 kv/mm

16Current breakdown

10A

17Peel strength

1.4N/mm

18S/M abrasion

>6H

19Thermal stress

288℃ 20 Sec

20Test Voltage

50-300V

21Min. blind/buried via

0.2mm/0.2mm(Mechanical) 0.1mm/0.2mm(Laser)
22Available Laminates Material

CEM1, CEM3, FR-4, High-Tg FR4, Aluminum Base, Rogers, Taconic, Arlon etc.

23Finished board thickness tolerance

T>=0.8mm, Tolerance: +/-8%, T<0.8mm : +/-10%

24Out Layer Copper Thickness

1oz--6oz

25Inner Layer Copper Thickness

1/2oz--4oz

26Aspect Ratio

15:1

27SMT Mini. Solder Mask Width

0.08mm

28Mini. Solder Mask Clearance

0.05mm

29Plug Hole Diameter

0.2mm--0.60mm

30Impedance Control Tolerance

+/-10%

31Surface Finish

HASL,HAL(Lead free),Immersion Gold/Tin/Silver,Gold Plated, OSP, Gold Finger, Peelable mask

32Insulation Layer Thickness

0.075mm--5.00mm

33Special technology

Thick hard gold plating, Via in Pad, Counterbore&Countersunk etc.

flexible pcb capability

 

NOITEMTECHNICAL DATA
1Number of layers

Flex: 1~6layer

Rigid/flex: 2-10layer

2
Min trace Width/Spacing

12 & 18um (base Cu): 0.075/0.075mm


35um (base Cu): 0.1/0.1mm

3Min Space Between Coverlay Openings

0.2mm

4Edge of Coverlay Opening to Trace

0.20mm(preferred)

5Min Space between coverlay & solder pad

0.15mm

6Polyimide Films

0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils (100µ) as custmer requested.

7Thermobond Adhesives

Acrylic/Modified Acrylic, Modified Epoxy, Polyimide

8Copper Foils (RA or ED)

1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)

9Stiffeners

Polyimide, rigid FR4, PSA, metal, etc.

10FR-4 in Multi-layer Flex Circuits

Laminated to flex circuit to create rigid flex boards, typically with vias.

11Surface Finish

Electroless Ni/Au, Electrolytic soft/hard gold,

Tin plating, Imm.Tin, Entek/OSP
12Solder Resists

Coverlay, Photo-Imagable Resist

13Hole tolerance

±0.05mm

14Smallest Drill Size

0.2mm

15Largest Drill Size

6.35mm

16Smallest Slot Width

0.35mm

17Min.spacing between holes

0.15mm

18Minimum conductor edge to outline edge

≥0.1mm

19Min Spacing between coverlay & conductor

± 0.15mm

20Hole to outline edge

≥ 0.10mm

21Max Layer to Layer Mis-registration

± 0.10mm

22Tooling tolerances

Steel(Hard) tooling : ± 0.05mm

CNC drill/rout : ± 0.10mm

Knife(Soft) tooling : ± 0.25mm
23Copper Plated Thickness (PTH only)

8~15um; 20~30um; 30~70um(special)

24Au thickness

Electroless: Ni/Au Ni: 2~6um;Au:0.035~0.075um

Electrolytic soft/hard gold Ni: 2~9um;Au: 0.035~0.1um

metal core pcb capability

 

NOITEMTECHNICAL DATA
1Number of Layers

1-2Layers

2MaterialAluminum / Copper base

3Final Thickness

0.5-3.0mm

4Max Size

1200mm x 600mm

5Insulating Layer Thickness

50, 75, 100, 125, 150micron

6Min trace Width/Spacing

6mil/6mil(0.15/0.15mm)

7Copper Thickness

0.5oz-3oz

8Min hole size

0.6mm

9Thermal Conductivity

1.0-4.0W/m.K

10Aluminum Type

3003, 5052, 6061 etc.

11Breakdown voltage

2-8KV

12Min Solder Dam

4mil

13Min Hole Ring

4mil

14Twist&Bow

≤0.7%

15Test Voltage

50-300V

16Solder Mask Colour

White, Black, Red, Green, Blue, Yellow

17Silkscreen colour

White, Black

18Tolerance of Profile

+/-5mil

19Peel Strength

≥ 1.8 N/MM

20Surface Resistance

≥ 1*105 M

21Permittivity

≤ 4.4

22Disspation Factor

≤ 0.03

23Surface Treatment

HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating

MANUFACTURING LEAD TIME

 

As a quick turn PCB manufacturer, We fully understand short and accurate lead time is essential in today’s rapidly changing market place. Customers need to know the exact date of the PCBs delivery so they can prepare the project schedules ahead of time.

The fabrication of quick turn PCB prototype is our characteristic service with great advantages, no matter for pricing or lead time, we could even provide 24-Hour quick turn PCB prototype manufacturing service if needed, normally our standard lead time for small & middle volume PCB starts from 8 to 15 working days, for quick turn PCB prototype, the fastest and standard lead time is listed as below,

LAYERFASTEST LEAD TIMESTANDARD LEAD TIME
224 Hours 4 WD
4 48 Hours 5 WD
6 3 WD 6 WD
83 WD 7 WD
103 WD 8 WD
124 WD 8 WD
144 WD 9 WD
≥16 Up to difficulty Up to difficulty